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With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top package. TMV® solution is being applied to reduce the warpage and achieve the fine pitch PoP and stable stacking performance. Currently, 0.4mm MIF(Memory Interface...
PoP technology is emerging as an alternative solution to SiP since it has advantage of easier testing and sourcing Flux-dipping PoP has risk of cold open joints due to package reflow warpage. Controlling warpage is challenging especially when top/bottom package come from different suppliers. New SMT paste STAMP was developed to enlarge process window of PoP stacking. The paste consists of higher m...
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